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Which processes limit purity and resolution in FEBID?

Low-energy secondary electrons (SEs) are produced abundantly by inelastic scattering in the solid of the primary keV electron beam and of backscattered electrons (BSEs) that reach areas outside of the primary beam focus. SE yields as a function of their energy typically peak well below 10 eV. SEs can thus efficiently drive precursor fragmentation via dissociative electron attachment (DEA) and this process contributes to the formation of deposit outside of the beam focus (halo formation or proximity effect). Also, DEA often leads to particularly incomplete precursor fragmentation and thus limits deposit purities as summarized by two review articles:

Specifically tailored silane compounds with (1,1-dichloro-1-silacyclohexane) and without chlorine substituents (silacyclohexane) were synthesized to investigate processes that limit the resolution in deposit formation. In contrast the chlorine carrying precursor, silacyclohexane does not fragment noticeably via DEA. However, the observed proximity effect in FEBID is only slightly different. This gives evidence that dissociative ionization (DI) also plays a significant role in FEBID:

The contribution in deposit formation of SEs exiting from the underlying substrate can be diminished by suitably tailored organic adlayers. According to SEM images, these layers prevent slow electron from crossing the solid-vacuum interface presumably by changing the work function of the surface. Also, such layers suppress catalytic activity of the surface that would counteract the spatial selectivity of FEBID: